Conference

Stamping

S020: Digital Integration of the Stamping and BiW Process Chains

  • Date

  • Time

  • Location

    N213-214

Overview

Digital Integration of the Stamping and BiW Process Chains

1:00 pm – 2:30 pm Intermediate

Digitalization of the complete BiW process chain is a key to facing the challenges of car body engineers due to trends like electrification, new mobility concepts, autonomous driving and shortening time-to-market. While product development and stamping engineering have seen enormous advances to accelerate the engineering process by using digital tools, the BiW assembly process and its upstream implications for the design and production of single body parts has seen much less attention in terms of digital process simulation.

This presentation introduces an integrated methodology to simulate the BiW assembly process and predict the resulting assembly including physical and geometric aspects. Furthermore, this integrated approach enables production engineers to gain insights into the interactions between BiW assembly and stamping production processes. This has the potential to dramatically change how single parts will be manufactured relative to shape and tolerances needed for final fit, and how related stamping tools should be compensated.

About the Speaker

  • Todd McClanahan

    Biography

    Todd McClanahan is a Senior Application Engineer with AutoForm Engineering USA, and supports users in developing methodologies to simulate the sheet metal forming and assembly processes. Prior to AutoForm, he spent over 18 years in the automotive stamping industry with Honda Engineering, North America. His responsibilities included tooling design, manufacturing feasibility, and engineering and project management for automotive programs. There he recognized the importance of efficiency in design and manufacturing.

    More Details about Todd

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